Pick and place tool for integrated circuit package

A pick and place tool comprising:

• a housing defining a downward receiving cavity dimensioned to comply with an IC package periphery for receiving said IC package therein;
• a sealing stuff disposed in the housing, said sealing stuff defining a deformable sealing portion downward facing to said receiving cavity;
• and
• a pole associated with the housing and moveable relative to the housing;
• wherein the sealing stuff is adapted to pick up the IC package by deformation of the sealing portion under a negative air pressure, and later to place said IC package into a socket by ejection of said IC package via a movement of said pole which breaks said negative air pressure and make said IC package released from the sealing portion and allow the IC package to downward move and be place in a position.

A pick and place tool comprising:

• a housing defining a downward receiving cavity dimensioned to comply with an IC package periphery for receiving said IC package therein;
• a sealing stuff disposed in the housing, said sealing stuff defining a deformable sealing portion downward facing to said receiving cavity, said sealing portion defining a sealing plane;
• and
• a pole associated with the housing and moveable relative to the housing;
• wherein the sealing stuff is adapted to pick up the IC package by deformation of the sealing portion under a negative air pressure, and later to place said IC package into a socket by ejection of said IC package via a movement of said pole which has a tail portion extends beyond the sealing plane to have said IC package released from the sealing portion and allow the IC package to downward move and be place in a position.