Test system for semiconductor components having conductive spring contacts

A system for testing a semiconductor wafer containing a plurality of semiconductor components having a plurality of component contacts comprising:

• a test circuitry configured to apply test signals to the components;
• a wafer probe handler configured to support and move the wafer;
• and
• an interconnect on the wafer probe handler comprising a substrate, and a plurality of interconnect contacts on the substrate configured to electrically engage the component contacts, each interconnect contact comprising a base portion on the substrate, a shaped spring segment portion on the base portion, and a tip portion on the spring segment portion for contacting a component contact.

A system for testing a semiconductor wafer containing a plurality of semiconductor components having a plurality of component contacts comprising:

• a test circuitry configured to apply test signals to the components;
• a wafer probe handler configured to support and move the wafer;
• and
• an interconnect on the wafer probe handler comprising a substrate, and a plurality of interconnect contacts on the substrate configured to electrically engage the component contacts, each interconnect contact comprising a compliant conductive layer comprising a base portion lining an opening in the substrate, a shaped spring segment portion attached to base portion, and a tip portion on the shaped spring segment portion configured to contact a component contact.

A system for testing a semiconductor component having a plurality of component contacts comprising:

• a test circuitry configured to apply test signals to the components;
• a test carrier configured to retain the component;
• and
• an interconnect on the test carrier comprising a substrate and a plurality of interconnect contacts on the substrate in electrical communication with the test circuitry and configured to electrically engage the component contacts,
• each interconnect contact comprising a base portion on the substrate, a shaped spring segment portion on the base portion, and a tip portion on the spring segment portion for contacting a component contact.

A system for testing a semiconductor component having a component contact comprising:

• a test circuitry configured to apply test signals to the component;
• a test apparatus configured to handle the component;
• and
• an interconnect on the test apparatus comprising a substrate, and a plurality of interconnect contacts on the substrate in electrical communication with the test circuitry and configured to electrically engage the component contacts,
• each interconnect contact comprising an opening in the substrate, a base portion lining the opening, a spring segment portion attached to base portion having an enclosed interior portion, and a tip portion on the spring segment portion configured to move in an axial direction to contact the component contact.