Semiconductor device, semiconductor substrate and fabrication process of a semiconductor device
AssigneeFujitsu Limited
InventorsKatsuyoshi Kirikoshi, Eiichi Kawamura
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AssigneeFujitsu Limited
InventorsKatsuyoshi Kirikoshi, Eiichi Kawamura
Estimating the term…
A semiconductor device includes a first insulation layer including a first conductor pattern, a second insulation layer formed on the first insulation layer and including a second conductor pattern, and a third conductor pattern formed on the second insulation layer, wherein there is formed a first alignment mark part in the first insulation layer by a part of the first conductor pattern, the third conductor pattern is formed with a second alignment mark part corresponding to the first alignment mark part, the first and second alignment marks forming a mark pair for detecting alignment of the first conductor pattern and the third conductor pattern, the second conductor pattern being formed in the second insulation layer so as to avoid the first alignment mark part.
A semiconductor device, comprising:
A semiconductor substrate, in which a large number of semiconductor devices are formed in regions defined by a scribe region, each of said semiconductor devices comprising:
-11. (canceled)
Dependencies are inferred from the claim text.