Heat dissipation structure and method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsuch-Chung Chen, Yi-Lung Cheng, Hsien-Wei Chen, Shin-Puu Jeng
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Abstract
A semiconductor structure and method for dissipating heat away from a semiconductor device having a plurality of power lines is provided. The semiconductor structure includes a semiconductor substrate and a plurality of interconnect structures disposed on the substrate and in contact therewith and extending through the semiconductor device, the interconnect structures for dissipating heat to the substrate. Each of the plurality of interconnect structures comprises at least one via stack.
Claims17
1-25. (canceled)
A semiconductor configuration for dissipating heat away from a semiconductor device having a plurality of power lines, the configuration comprising:
- a semiconductor substrate;
- and
- a plurality of interconnect structures disposed on the substrate and in contact therewith and extending through the semiconductor device, the interconnect structures for dissipating heat through the substrate,
- wherein the plurality of interconnect structures are embedded into and isolated from a power line.
A semiconductor configuration for dissipating heat away from a semiconductor device having a plurality of power bus lines, comprising:
- a semiconductor substrate;
- and
- a plurality of interconnect structures, each of the interconnect structures having at least one via stack, the interconnect structures disposed on the substrate and in contact therewith and extending through the semiconductor device, the interconnect structures for dissipating heat through the substrate,
- wherein the plurality of interconnect structures are alternatively spaced apart and embedded into a single serpentine power line by a distance.
A semiconductor configuration for dissipating heat away from a semiconductor device having a plurality of power lines, comprising:
- a semiconductor substrate;
- and
- a plurality of interconnect structures disposed on the substrate and in contact therewith and extending through the semiconductor device, the interconnect structures for dissipating heat through the substrate,
- wherein the plurality of interconnect structures are embedded into and periodically spaced apart along a longitudinal axis of a serpentine power line by a distance.
A method for forming a semiconductor configuration for dissipating heat away from a semiconductor device having a plurality of power bus lines, comprising:
- providing a semiconductor substrate;
- and
- forming a plurality of interconnect structures disposed on the substrate and in contact therewith and extending through the semiconductor device, the interconnect structures for dissipating heat through the substrate,
- wherein the plurality of interconnect structures are embedded into and isolated from a plurality of power bus lines.
Dependencies are inferred from the claim text.