Chemical mechanical polishing (CMP) slurries and CMP methods using and making the same
OwnerJong-heun Lim, Jae-dong Lee +2inventors
InventorsJong-heun Lim, Jae-dong Lee, Bo-un Yoon, Chang-ki Hong
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Abstract
In one aspect, a chemical-mechanical-polishing (CMP) slurry composition is provided which includes ceria abrasive contained in a solution, where the solution includes a viscosity increasing agent which includes a non-ionic polymer compound, and where a viscosity of the composition is at least 1.5 cP. In other aspects, the viscosity increasing agent includes one or more of poly(ethyleneglycol), a Gum compound and isopropyl alcohol.
Claims54
A chemical-mechanical-polishing (CMP) slurry composition, comprising ceria abrasive contained in a solution, the solution comprising a viscosity increasing agent which includes a non-ionic polymer compound, wherein a viscosity of the composition is at least 1.5 cP.
The CMP slurry composition of claim 4, wherein the viscosity is at most 2.5 cP.
A chemical-mechanical-polishing (CMP) slurry composition comprising ceria abrasive contained in a solution, the solution comprising poly(ethyleneglycol) (PEG), wherein the amount of PEG is 0.01 wt % to 5 wt % of the composition.
A chemical-mechanical-polishing (CMP) slurry composition comprising ceria abrasive suspended in a solution, the solution comprising a gum compound, wherein the amount of the gum compound is 0.01 wt % to 5 wt % of the composition.
A chemical-mechanical-polishing (CMP) slurry composition comprising ceria abrasive suspended in a solution, the solution comprising isopropyl alcohol (IPA), wherein the amount of IPA is 0.01 wt % to 10 wt % of the composition.
A chemical-mechanical-polishing (CMP) slurry composition comprising ceria abrasive suspended in a solution, the solution comprising a viscosity increasing agent, wherein the viscosity increasing agent includes a non-ionic polymeric compound, and wherein the amount of the viscosity increasing agent is 0.01 wt % to 10 wt % of the composition.
A chemical-mechanical-polishing (CMP) method, comprising:
- providing a CMP slurry composition which comprises ceria abrasive contained in a solution, wherein the viscosity increasing agent comprises a non-ionic polymeric compound, and wherein a viscosity of the composition is at least 1.5 cP;
- and
- moving a polishing pad relative to and against the surface of a substrate with the CMP slurry composition interposed between the polishing pad and the surface of the substrate.
A method of preparing a chemical-mechanical-polishing (CMP) slurry, comprising:
- providing a CMP slurry composition which comprises ceria abrasive contained in a solution, wherein a viscosity of the CMP slurry composition is less than about 1.3 cP;
- and
- admixing a viscosity increasing agent comprising a non-ionic polymeric compound into the CMP slurry composition to increase the viscosity of the CMP slurry composition to at least 1.5 cP.
Dependencies are inferred from the claim text.