Sputtering target, method for producing sputtering target, sputtering apparatus, and liquid-jet head
AssigneeSeiko Epson Corporation
InventorMasami Murai
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Abstract
A sputtering target, which is obtained by rolling a metallic material comprising platinum to form a metal plate having a predetermined thickness, and heating the metal plate for recrystallization, has crystallographic textures isotropic in any of the planar direction and the thickness direction, and has a maximum value of Vickers hardness of 60 or lower. A method for producing the sputtering target, a sputtering apparatus, and a liquid-jet head are also disclosed.
Claims9
A sputtering target obtained by rolling a metallic material comprising platinum to form a metal plate having a predetermined thickness, and heating the metal plate for recrystallization,
- said sputtering target having crystallographic textures isotropic in any of a planar direction and a thickness direction thereof, and a maximum value of Vickers hardness of 60 or lower.
A method for producing a sputtering target, comprising:
- a rolling step of rolling a metallic material comprising platinum to form a metal plate having a predetermined thickness;
- and
- a reheating step of heating the metal plate for recrystallization so that crystallographic textures constituting the metal plate are isotropic in any of a planar direction and a thickness direction of the metal plate, and a maximum value of Vickers hardness of the metal plate is 60 or lower.
Dependencies are inferred from the claim text.