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US 2006/0079070 A1Published application
Substrate for stressed systems and method of making same
AssigneeS.O.I.Tec Silicon on Insulator Technologies
InventorsFabrice Letertre, Bruno Ghyselen, Olivier Rayssac
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Abstract
A stress absorbing microstructure assembly including a support substrate having an accommodation layer that has plurality of motifs engraved or etched in a surface, a buffer layer and a nucleation layer. The stress absorbing microstructure assembly may also include an insulating layer between the buffer layer and the nucleation layer. This assembly can receive thick epitaxial layers thereon with concern of causing cracking of such layers.
Claims20
A method of fabricating a stress absorbing microstructure assembly which comprises:
- implanting atomic species on a transfer substrate so as to provide a plane of weakness on the transfer substrate;
- associating a mechanical stress absorbing system with a support substrate;
- assembling the transfer substrate in a face to face orientation with the support substrate;
- treating the plane of weakness to further weaken it without generating cracking of the transfer substrate;
- and
- detaching a portion of the transfer substrate so that a second portion of the transfer substrate remains on the support substrate.
3 more elements
Dependencies are inferred from the claim text.