Flexible circuit board processing method
OwnerAkihiro Nakamurainventor
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Abstract
It is an object of this invention to provide a flexible circuit board processing method which controls an outflow of a sealing material to be appropriate when packaging a component on a flexible circuit board. There is provided a flexible circuit board processing method for, when packaging a chip component (10) on a flexible circuit board, filling the surroundings of the chip component in a component-mounting portion on the board with a sealing material (20), wherein a surface (A) of the component-mounting portion is subjected in advance to a modification process to improve the wettability to the sealing material.
Claims4
A flexible circuit board processing method for, when packaging a chip component on a flexible circuit board, filling surroundings of the chip component in a component-mounting portion on the board with a sealing material,
- wherein a surface of the component-mounting portion is subjected in advance to a modification process to improve wettability to the sealing material.
Dependencies are inferred from the claim text.