US 2006/0079023 A1 · Semiconductor device and manufacturing method for the same

Abstract

A semiconductor device and a manufacturing method for the same are provided wherein the reliability of connections of fine metal wires connecting a second semiconductor chip to a wiring board can be improved in the case wherein the second semiconductor chip, which is located above the lower, first semiconductor chip, is significantly larger than the first semiconductor chip in a configuration wherein two semiconductor chips are stacked and mounted on a wiring board. In this semiconductor device the rear surface of the first semiconductor chip and the rear surface of the second semiconductor chip are adhered to each other by means of adhesive and the side of the adhesive is inclined from the edge portions of the first semiconductor chip toward the portions of the second semiconductor chip extending from the side of the first semiconductor chip. Therefore, it becomes possible to prevent the occurrence of microcracks in the second semiconductor chip and to prevent the occurrence of defective fine metal wire connections caused by the impact at the time of electrical connection of the second semiconductor chip to the wiring board.

Claims5

Dependent claims

1-7. (canceled)

A manufacturing method for a semiconductor device, comprising:

the step of preparing a wiring board having a first wiring electrode and a second wiring electrode as well as a first semiconductor chip having an electrode on the top surface;
the step of electrically connecting the first wiring electrode of said wiring board to the electrode of said first semiconductor chip via a bump;
the step of preparing a second semiconductor chip that is larger than the first semiconductor chip and that has an electrode in at least the periphery of the top surface;
the step of adhering the rear surface of said first semiconductor chip, which is the side opposite to the electrode, and the rear surface of said second semiconductor, which is the side opposite to the electrode, to each other by means of adhesive;
and
the step of connecting the electrode of said second semiconductor chip to the second wiring electrode of said wiring board by means of a fine metal wire, wherein
said adhesive is formed so that the side of said adhesive is inclined from the end portions of said first semiconductor chip toward the portions of said second semiconductor chip extending from the sides of the first semiconductor chip at the time of the step of adhering said first semiconductor chip and said second semiconductor chip to each other.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application

11/281,366Filed 18 Nov 2005

Priority

JP 2003-02031329 Jan 2003

Published

13 Apr 2006

Term ends

Not estimatedThe source records don’t support an estimate.

Classification40 codes

H10W 74/014
Manufacture or treatment: using batch processing
H10W 72/20
Interconnections or connectors in packages: bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
H10W 74/012
Manufacture or treatment: of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
H10W 74/114
The semiconductor body being completely enclosed: by a substrate and the encapsulations

Semiconductor device and manufacturing method for the same

Life of this patent

Semiconductor device and manufacturing method for the same

Life of this patent

Abstract

Claims5