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US 2006/0078715 A1Published application
Bonding structure of device packaging
AssigneeIndustrial Technology Research Institute
InventorSu-Tsai Lu
Life of this patent
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Abstract
A bonding structure of device packaging includes a first substrate and a second substrate. The surfaces of the first substrate have metal pads and a first bonding layer connected to the second substrate whose surfaces have a second bonding layer and electrodes. The first bonding layer is combined with the second bonding layer, and the metal pads are in electrical communications with the electrodes. The second substrate may be a flexible substrate to decrease the strain between the first substrate and the second substrate.
Claims16
A bonding structure of device packaging, comprising:
- a first substrate, whose surface has a plurality of metal pads and a first bonding metal layer;
- and
- a second substrate, whose surface has a plurality of electrodes and a second bonding metal layer;
- wherein the second bonding metal layer is adhered onto the first bonding metal layer so that the first substrate and the second substrate are bonded together, and the metal pads are in electrical communications with the electrodes.
1 more element
Dependencies are inferred from the claim text.