Automatic analysis and control system for electroless composite plating solution
AssigneeC. Uyemura & Co., Ltd.
InventorsTadashi Chiba, Koji Monden, Kazuki Yoshikawa, Shinji Tachibana
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AssigneeC. Uyemura & Co., Ltd.
InventorsTadashi Chiba, Koji Monden, Kazuki Yoshikawa, Shinji Tachibana
Estimating the term…
An automatic analysis and control system for electroless composite plating solution for automatically analyzing an electroless composite plating solution and performing such a control as to obtain an appropriate bath composition and/or use conditions, wherein, as a technique for measuring the concentration of a metallic component in the plating solution by absorptiometry, the system includes a mechanism for measuring transmissivity or absorbance at least two or more different wavelengths after the plating solution is automatically introduced into an analytical cell, and a mechanism for calculating the objective concentration from the measured values and displaying the calculation results.
1-7. (canceled)
An automatic analysis and control method for electroless composite plating solution for automatically analyzing an electroless composite plating solution and performing control to obtain an appropriate bath composition and/or use conditions as a technique for measuring the concentration of a metallic component in said electroless composite plating solution by absorptiometry, said automatic analysis and control method comprising:
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