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US 2006/0078247 A1Published application
Package structure for optical modulator
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYeong Gyu Lee, Jong Hyeong Song, Heung Woo Park, Suk Kee Hong, Chang Su Park, Ohk Kun Lim
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Abstract
Disclosed herein is a package structure for an optical modulator, which is configured such that an optical modulating device and electronic control circuitry are incorporated into a module, thus allowing the manufacture of a compact module while maintaining the optical properties of the optical modulating device.
Claims26
A package structure for an optical modulator, comprising:
- a transparent substrate;
- an optical modulating device disposed on the transparent substrate;
- electronic circuitry for controlling the optical modulating device, said electronic circuitry disposed on the transparent substrate;
- a printed circuit board on which the transparent substrate is disposed, said printed circuit board configured to permit light to pass into the package structure to the optical modulating device and to permit light to pass from the optical modulating device out though the package structure;
- and
- an electrical connection system electrically interconnecting the optical modulating device, the electronic control circuitry, and the printed circuit board.
3 more elements
A package structure for an optical modulator, comprising:
- a transparent substrate;
- an optical modulating device disposed on the transparent substrate;
- electronic circuitry for controlling the optical modulating device, said electronic circuitry disposed on the transparent substrate;
- and
- an electrical connection system extending between the optical modulating device and the electronic control circuitry, said electrical connection system incorporated into the transparent substrate.
2 more elements
Dependencies are inferred from the claim text.