Transparent member, optical device using transparent member and method of manufacturing optical device

An optical device comprising a substrate, a chip as an optical element mounted to said substrate and a sealing member with transparency provided at said substrate for the purpose of sealing said chip, wherein

• said optical device is formed by dividing an immediate body along phantom lines in a grid pattern, and wherein
• said intermediate body comprises
• a whole substrate having a plurality of regions sectioned by the phantom lines in the grid pattern to correspond to a plurality of substrates, respectively,
• a plurality of chips mounted to said plurality of regions, respectively,
• a whole sealing member having a plurality of sealing members corresponding to said plurality of regions, respectively, and integrally provided on said whole substrate.

A method of manufacturing an optical device, comprising the steps of:

• mounting a chip as an optical element to a substrate;
• fixing a protecting member to said substrate so as to surround said chip;
• and
• attaching a transparent member to a top surface of said protecting member, wherein
• said step of attaching said transparent member includes the steps of
• molding one molded body having a plurality of transparent members, one of said plurality of transparent members being arranged at a corresponding one of a plurality of regions sectioned by phantom lines in a grid pattern;
• and
• dividing said one molded body along said phantom lines to form each of said plurality of transparent members.

A method of manufacturing an optical device comprising a substrate, a chip as an optical element mounted to said substrate, a protecting member provided at said substrate so as to surround said chip and a transparent member attached to a top surface of said protecting member, comprising the steps of:

• preparing a whole substrate having a plurality of regions which can be sectioned by phantom lines in a grid pattern to correspond to a plurality of substrates, respectively;
• mounting a plurality of chips to said plurality of regions, respectively;
• integrally attaching a whole protecting member having a plurality of protecting members to said whole substrate;
• forming one intermediate body by attaching one molded body to a top surface of said whole protecting member, said one molded body having a plurality of transparent members arranged at the plurality of regions, respectively, sectioned by said phantom lines in a grid pattern;
• and
• dividing said one intermediate body along said phantom lines in said grid pattern to form a plurality of optical devices each having said substrate, said protecting member, said transparent member and said chip.

A method of manufacturing an optical device comprising a substrate, a chip as an optical element mounted to said substrate and a sealing member with transparency provided at said substrate for the purpose of sealing said chip, comprising the steps of:

• preparing a whole substrate having a plurality of regions which can be sectioned by phantom lines in a grid pattern to correspond to a plurality of substrates, respectively;
• mounting a plurality of chips to said plurality of regions, respectively;
• forming one intermediate body by integrally providing a whole sealing member having a plurality of sealing members at said whole substrate;
• and
• dividing said one intermediate body along said phantom lines in said grid pattern to form a plurality of optical devices each having said substrate, said sealing member and said chip.