Device having patterned spacers for backplates and method of making the same
AssigneeQUALCOMM MEMS Technologies, Inc.
InventorsPhilip Floyd, Brian Arbuckle
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Abstract
Described herein are systems, devices, and methods relating to packaging electronic devices, for example, microelectromechanical systems (MEMS) devices, including optical modulators such as interferometric optical modulators. The packaging system disclosed herein comprises a patterned spacer that, in some embodiments, is fabricated using thin-film methods. In some embodiments, the spacer together with a substrate and backplate package an electronic device.
Claims29
A display device, comprising:
- a substrate on which an array of interferometric optical modulators is formed,
- a backplate, and
- a patterned spacer disposed between the substrate and the backplate to form a package, wherein the spacer circumscribes the array and prevents the external environment from entering the package.
A method for fabricating a display device comprising:
- obtaining a substrate on which an array of interferometric optical modulators is formed;
- obtaining a backplate;
- forming a spacer by patterning, wherein said spacer is configured to circumscribe the array and prevent the external environment from contacting the array;
- and
- assembling the substrate, backplate, and spacer to provide the display device.
A display device fabricated by a method comprising:
- obtaining a substrate on which a microelectromechanical device is formed;
- obtaining a backplate;
- forming a spacer by patterning, wherein said spacer is configured to circumscribe the array and prevent the external environment from contacting the array;
- and
- assembling the substrate, backplate, and spacer to provide the display device.
Dependencies are inferred from the claim text.