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US 2006/0077029 A1Published application
Apparatus and method for constructions of stacked inductive components
AssigneeFreescale Semiconductor, Inc.
InventorThomas Koschmieder
Life of this patent
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Abstract
An inductive component is formed by stacking a plurality of layers of a strip comprising inductive element portions disposed at a flexible, non-conductive material to form a substrate, where each of inductive element portions is electrically coupled to an adjacent inductive element portion to form the inductive component.
Claims21
An apparatus comprising:
- a plurality of layers, each layer comprising:
- a conductive material to provide a portion of an inductive element;
- and
- a flexible, non-conductive substrate substantially enclosing the conductive material;
- wherein the conductive material of each of the plurality of layers is electrically coupled to the conductive material of one or more adjacent layers.
2 more elements
An apparatus comprising:
- a strip of flexible non-conductive material;
- and
- a plurality of conductive material portions disposed in the strip, each conductive material portion to provide a respective portion of an inductive element;
- wherein the strip is folded between adjacent conductive material portions of the plurality of conductive material portions so that a first portion of a side of the strip is aligned to a second portion of a side of the strip.
1 more element
A method comprising:
- providing a first layer of flexible non-conductive material;
- disposing a plurality of conductive material portions at the first layer of flexible non-conductive material;
- providing a second layer of flexible non-conductive material overlaying the first layer of flexible non-conductive material and the plurality of conductive material portions;
- and
- folding the first and second layers of flexible non-conductive material between the plurality of conductive material portions.
2 more elements
An inductive element comprising:
- a first flexible non-conductive layer;
- a second flexible non-conductive layer adjacent to the first flexible non-conductive layer;
- a third flexible non-conductive layer adjacent to the second flexible non-conductive layer;
- a fourth flexible non-conductive layer adjacent to the third flexible non-conductive layer;
- a first conductive material portion disposed between the first and second flexible non-conductive layers, wherein the first conductive material portion is to provide a first portion of a an inductive element;
- a second conductive material portion disposed between the third and fourth flexible non-conductive layers, wherein the second conductive material portion is to provide a second portion of the reactive element;
- and
- wherein the first conductive material portion and the second conductive material portion are electrically coupled through the second and third flexible non-conductive layers.
5 more elements
Dependencies are inferred from the claim text.