Method and system for providing MEMS device package with secondary seal
OwnerLauren Palmateer, Brian Gally +1inventors
InventorsLauren Palmateer, Brian Gally, William Cummings
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Abstract
A MEMS device package comprises a substrate with a MEMS device formed thereon, a backplane, and a primary seal, wherein the primary seal is positioned between the backplane and the substrate to encapsulate and seal the MEMS device package from ambient conditions. The MEMS device package further comprises a secondary seal in contact with at least the backplane and the substrate.
Claims48
A microelectromechanical system (MEMS) device, comprising:
- a substrate;
- a MEMS device formed on said substrate;
- a backplane;
- a primary seal positioned proximate a perimeter of the MEMS device and in contact with said substrate and said backplane;
- and
- a secondary seal positioned proximate an outer periphery of said primary seal and in contact with said substrate and said backplane.
A method of sealing a microelectromechanical system (MEMS) device package, comprising:
- providing a MEMS device package comprising a backplane and a substrate, wherein a MEMS device is formed on said substrate;
- providing a primary seal formed proximate a perimeter of said MEMS device and between said backplane and said substrate;
- and
- forming a secondary seal proximate an outer periphery of said primary seal and in contact with said substrate and said backplane.
A system for sealing a microelectromechanical system (MEMS) device package, comprising:
- a MEMS device package comprising a backplane and a substrate, wherein a MEMS device is formed on said substrate;
- a primary seal formed proximate a perimeter of said MEMS device and between said backplane and said substrate;
- and
- means for sealing an outer periphery of said primary seal, wherein said means is in contact with said substrate and said backplane.
A microelectromechanical system (MEMS) device package comprising a primary inner seal and a secondary outer seal, wherein said package is produced by a method comprising:
- providing a MEMS device package comprising a backplane and a substrate, wherein a MEMS device is formed on said substrate;
- providing a primary seal formed proximate a perimeter of said MEMS device and between said backplane and said substrate;
- and
- forming a secondary seal proximate an outer periphery of said primary seal and in contact with said substrate and said backplane.
A microelectromechanical system (MEMS) device package, comprising:
- a substrate;
- a MEMS device formed on said substrate;
- a backplane;
- a seal positioned proximate a perimeter of said MEMS device and in contact with said substrate and said backplane;
- a flexible circuit;
- and
- an anisotropic conductive film in contact with said flexible circuit, said substrate, and said backplane.
A method of assembling a microelectromechanical system (MEMS) device package, comprising:
- contacting a flexible circuit, an anisotropic conductive film, and a substrate, wherein said substrate comprises a MEMS device thereon, and a seal proximate a perimeter of said MEMS device and in contact with said substrate and a backplane;
- and
- applying a force to said flexible circuit so as to force said anisotropic conductive film into contact with said backplane.
Dependencies are inferred from the claim text.