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US 2006/0076593 A1Published application
Method to sputter deposit metal on a ferroelectric polymer
OwnerHitesh Windlass, Ebrahim Andideh +3inventors
InventorsHitesh Windlass, Ebrahim Andideh, Daniel Diana, Mark Richards, William Hicks
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Abstract
Methods of depositing various metal layers adjacent to a ferroelectric polymer layer are disclosed. In one embodiment, a collimator may be used during a sputtering process to filter out charged particles from the material that may be deposited as a metal layer. In various embodiments, a metal layer may contain at least one of an intermetallic layer, an amorphous intermetallic layer, and an amorphized intermetallic layer.
Claims10
An apparatus comprising:
- an integrated circuit comprising:
- a first metal layer of at least one of TiN, TaN, TiNSi, and TaNSi, and
- a layer of ferroelectric polymer material coupled to the first metal layer.
A system comprising:
- flash memory comprising:
- an integrated circuit comprising
- a first metal layer of at least one of TiN, TaN, TiNSi, and TaNSi, and
- a layer of ferroelectric polymer material coupled to the first metal layer.
1 more element
Dependencies are inferred from the claim text.