Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom
AssigneeS.O.I.Tec Silicon on Insulator Technologies
InventorsBruno Ghyselen, Cecile Aulnette, Benedite Osternaud, Yves-Mathieu Le Vaillant, Takeshi Akatsu
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Abstract
A donor wafer resulting from a method of recycling the wafer after detaching at least one useful layer. The donor wafer includes a substrate; a buffer structure on the substrate; a protective layer associated with the buffer structure; and a post detachment layer located above the buffer structure and presenting projections or rough portions on its surface. The protective layer prevents removal of the entire buffer structure when the post detachment layer is removed.
Claims20
A donor wafer having supplied a useful layer by detachment and capable of being recycled comprising:
- a substrate;
- a buffer structure on the substrate;
- a protective layer associated with the buffer structure;
- a post detachment layer located above the buffer structure and presenting projections or rough portions on its surface;
- whereas the protective layer prevents removal of the entire buffer structure when the post detachment layer is removed.
Dependencies are inferred from the claim text.