Semiconductor device and method for manufacturing the same
AssigneeSony Corporation
InventorsDaisuke Hobara, Shinichiro Kondo
Life of this patent
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Abstract
A semiconductor device and method for manufacturing the same are provided. The semiconductor device includes conductor or semiconductor fine particles, and organic semiconductor molecules bonded to the fine particles to form a conductive path, the conductivity of the conductive path being controlled by an electric field. In the semiconductor device, protective film molecules bonding to the adjacent fine particles bond to each other to form the organic semiconductor molecules which connect the fine particles to each other.
Claims32
A semiconductor device comprising:
- one or more fine particles;
- and
- one or more organic semiconductor molecules bonded to the fine particles to form a conductive path having a conductivity that is controlled by an electric field;
- wherein one or more protective film molecules bonding to the adjacent fine particles bond to each other to form the organic semiconductor molecules which connect the fine particles to each other.
A method for manufacturing a semiconductor device including one or more fine particles and one or more organic semiconductor molecules bonded to the fine particles to form a conductive path having a conductivity that is controlled by an electric field, the method comprising:
- bonding protective film molecules, which produce the respective organic semiconductor molecules, to the fine particles;
- and
- disposing a plurality of the fine particles and forming bonding between the protective film molecules of the adjacent fine particles to produce the organic semiconductor molecules which connect the fine particles to each other.
Dependencies are inferred from the claim text.