Methods of fabricating interferometric modulators by selectively removing a material
AssigneeIdc, LLC
InventorsMing-Hau Tung, Philip Floyd, Brian Arbuckle
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AssigneeIdc, LLC
InventorsMing-Hau Tung, Philip Floyd, Brian Arbuckle
Estimating the term…
Methods for making MEMS devices such as interferometric modulators involve selectively removing a sacrificial portion of a material to form an internal cavity, leaving behind a remaining portion of the material to form a post structure. The material may be blanket deposited and selectively altered to define sacrificial portions that are selectively removable relative to the remaining portions. Alternatively, a material layer can be laterally recessed away from openings in a covering layer. These methods may be used to make unreleased and released interferometric modulators.
A method for making a MEMS device comprising:
An unreleased MEMS substrate comprising a material, the MEMS substrate being configured so that a sacrificial portion of the material is removable to form a cavity;
A method for making an interferometric modulator, the interferometric modulator comprising at least a first mirror, a second mirror separated from the first mirror by a cavity, and a post structure positioned at a side of the cavity and configured to support the second mirror spaced from the first mirror, the method comprising:
Dependencies are inferred from the claim text.