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US 2006/0076230 A1Published application
Sputtering target fixture
AssigneeInternational Business Machines Corporation
InventorsWilliam Murphy, David Strippe
Life of this patent
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Abstract
A method and apparatus for sputter deposition. The method including: providing a sputter target having a back surface and an exposed front surface; providing a source of magnetic field lines, the magnetic field lines extending through the sputter target from the back surface to the exposed front surface of the sputter target; providing one or more pole extenders between magnetic poles of the source of the magnetic field lines and the exposed front surface of the sputter target.
Claims30
A method of sputter deposition, comprising:
- providing a sputter target having a back surface and an exposed front surface;
- providing a source of magnetic field lines, said magnetic field lines extending through said sputter target from said back surface to said exposed front surface of said sputter target;
- and
- providing one or more pole extenders between magnetic poles of said source of said magnetic field lines and said exposed front surface of said sputter target.
1 more element
An apparatus, comprising:
- a sputter target having a back surface and an exposed front surface;
- a source of magnetic field lines, said magnetic field lines extending through said sputter target from said back surface to said exposed front surface of said sputter target;
- and
- one or more pole extenders between magnetic poles of a source of said magnetic field lines and said exposed front surface of said sputter target.
1 more element
Dependencies are inferred from the claim text.