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US 2006/0069171 A1Published application
Composition and method
AssigneeRohm and Haas Electronic Materials LLC
InventorsGregory Prokopowicz, Michael Gallagher
Life of this patent
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Abstract
Compositions useful in the preparation of porous organic polysilica films, particularly for use in the manufacture of integrated circuits, are provided. Methods of forming such compositions and films are also provided.
Claims12
A composition comprising a B-staged organic polysilica material and a porogen, wherein the porogen comprises an aryl group-containing organic radical-capped polyol moiety.
An electronic device comprising a substrate and an organic polysilica film, wherein the film comprises a porogen comprising an organic radical-capped polyol moiety.
Dependencies are inferred from the claim text.