Protective tape separation method, and apparatus using the same
AssigneeNitto Denko Corporation
InventorMasayuki Yamamoto
Life of this patent
Estimating the term…
Abstract
The invention relates to an apparatus for separating a protective tape joined to a semiconductor wafer. Before joining a separation tape to a protective tape on a surface of a semiconductor wafer held, from its back side, by a ring frame via a dicing tape while pressing the separation tape against the protective tape with the use of an edge member, pure water is dropped from a piston nozzle onto the back side of the dicing tape located in front of a joining start end of the separation tape.
Claims12
A method for separating a protective tape from a semiconductor wafer with the protective tape held, from its back side, by a ring-shaped frame via a supporting adhesive tape, the method comprising the steps of:
- dropping a liquid material from dropping means at least onto an adhesion surface of the supporting adhesive tape at a joining start end side of a separative adhesive tape;
- and
- joining a non-adhesion surface of the separative adhesive tape to the protective tape joined to the semiconductor wafer by a joining member so as to press the non-adhesion surface against the protective tape after the liquid material is dropped onto the adhesion surface of the supporting adhesive tape, and integrally separating the separative adhesive tape and the protective tape from the surface of the semiconductor wafer by separating means.
A method for separating a protective tape from a semiconductor wafer with the protective tape held, from its back side, by a ring-shaped frame via a supporting adhesive tape, the method comprising the steps of:
- holding the semiconductor wafer by holding means with a protective tape adhesion surface facing downward;
- supplying a separative adhesive tape from separative adhesive tape supplying means with an adhesion surface facing upward so as to face the surface of the protective tape;
- dropping a liquid material from dropping means onto an adhesion surface on a joining start end side of the separative adhesive tape supplied so as to face the protective tape;
- and
- joining a non-adhesion surface of the separative adhesive tape to the protective tape joined to the semiconductor wafer by a joining member so as to press the non-adhesion surface against the protective tape after the liquid material is dropped onto the adhesion surface of the supporting adhesive tape, and integrally separating the separative adhesive tape and the protective tape from the surface of the semiconductor wafer by separating means.
An apparatus for separating a protective tape from a semiconductor wafer with the protective tape held, from its back side, by a ring-shaped frame via a supporting adhesive tape, the apparatus comprising:
- holding means for mounting and holding thereon the semiconductor wafer held by the ring-shaped frame;
- separative adhesive tape supplying means for supplying a separative adhesive tape toward the semiconductor wafer held by the holding means;
- separating means for joining the separative adhesive tape to the surface of the protective tape and integrally separating the separative adhesive tape and the protective tape from the surface of the semiconductor wafer by horizontally moving the holding means on which the semiconductor wafer is mounted and held and a joining member for pressing a non-adhesion surface of the separative adhesive tape relative to each other;
- dropping means for dropping a liquid material onto an adhesion surface of the supporting adhesive tape on a joining start end side of the separative adhesive tape before the separative adhesive tape is joined;
- and
- tape collecting means for collecting the protective tape integrated with the separated separative adhesive tape.
An apparatus for separating a protective tape from a semiconductor wafer with the protective tape held, from its back side, by a ring-shaped frame via a supporting adhesive tape, the apparatus comprising:
- holding means for holding the semiconductor wafer held by the ring-shaped frame with a protective tape adhesion surface facing downward;
- separative adhesive tape supplying means for supplying a separative adhesive tape toward the semiconductor wafer held by the holding means;
- separating means for joining the separative adhesive tape to the surface of the protective tape and integrally separating the separative adhesive tape and the protective tape from the surface of the semiconductor wafer by horizontally moving the holding means on which the semiconductor wafer is mounted and held and a joining member for pressing a non-adhesion surface of the separative adhesive tape relative to each other;
- dropping means for dropping a liquid material onto an adhesion surface of the separative adhesive tape on a joining start end side on which the separative adhesive tape is joined to the protective tape before the separative adhesive tape is joined;
- and
- tape collecting means for collecting the protective tape integrated with the separated separative adhesive tape.
Dependencies are inferred from the claim text.