Film forming condition determination method, film forming method, and film structure manufacturing method

A film forming condition determination method comprising:

• a first step of forming a dielectric film, whose dielectric constant based on electrical measurement is not lower than 50, on a substrate by setting a predetermined value for a film forming condition variable;
• a second step of analyzing a characteristic of the film formed in the first step by a spectroscopic ellipsometer;
• a third step of forming a dielectric film, whose dielectric constant based on electrical measurement is not lower than 50, on a substrate by setting a value different from the predetermined value set in the first step for the film forming condition variable;
• a fourth step of analyzing a characteristic of the film formed in the third step by the spectroscopic ellipsometer;
• and
• a fifth step of specifying a value of the film forming condition variable, based on a comparison between an analysis result in the second step and an analysis result in the fourth step.

A film forming condition determination method comprising the steps of:

• forming a dielectric film, whose dielectric constant based on electrical measurement is not lower than 50, on a substrate by setting a predetermined value for a film forming condition variable;
• analyzing and obtaining a refractive index of an accompanying dielectric film, formed on one side or both sides of the dielectric film, following the formation of the dielectric film, by a spectroscopic ellipsometer;
• comparing the obtained refractive index of the accompanying dielectric film and a refractive index of the dielectric film;
• determining from a comparison result, whether or not to change the film forming condition variable;
• and
• determining a film forming condition by specifying a film forming condition variable based on a determination result.

A film forming condition determination method comprising:

• a first step of forming a dielectric film whose dielectric constant based on electrical measurement is not lower than 50, on a substrate, by setting a predetermined value for a film forming condition variable, and stacking a film, whose refractive index is smaller than the dielectric film;
• a second step of analyzing and obtaining a refractive index of an accompanying dielectric film, formed at the interface on the substrate side, following the formation of the dielectric film in the first step, by a spectroscopic ellipsometer;
• a third step of forming a dielectric film, whose dielectric constant based on electrical measurement is not lower than 50, on a substrate, and stacking a film whose refractive index is smaller than the dielectric film on the dielectric film, by setting a value different from the predetermined value set in the first step for the film forming condition variable;
• a fourth step of analyzing and obtaining a refractive index of an accompanying dielectric film, formed at the interface on the substrate side, following the formation of the dielectric film in the third step, by the spectroscopic ellipsometer;
• and
• a fifth step of specifying a value of the film forming condition variable by comparing the refractive index of the accompanying dielectric film obtained in the second step and the refractive index of the accompanying dielectric film obtained in the fourth step.

A film forming method comprising:

• a first step of forming a film by a first film forming apparatus, by setting a predetermined value for a film forming condition variable in the first film forming apparatus;
• a second step of analyzing a characteristic of the film formed in the first step;
• a third step of forming a film by a second film forming apparatus by setting a value corresponding to the predetermined value set in the first film forming apparatus for a film forming condition variable in the second film forming apparatus;
• a fourth step of analyzing a characteristic of the film formed in the third step by a spectroscopic ellipsometer;
• a fifth step of comparing an analysis result in the second step and an analysis result in the fourth step;
• if it is found by the comparison in the fifth step, that the analysis results differ, a sixth step of specifying a value of the film forming condition variable to be set in the second film forming apparatus so that the analysis result in the fourth step becomes closer to the analysis result in the second step;
• and
• a seventh step of forming a film by the second film forming apparatus by setting the value specified in the sixth step for the film forming condition variable in the second film forming apparatus.

A film structure manufacturing method for manufacturing a film structure, by performing processes in a plurality of film forming steps one after another, comprising the steps of:

• analyzing a characteristic of an intermediate film structure, processed in each film forming step, by a spectroscopic ellipsometer;
• determining whether or not the analyzed characteristic is within a reference characteristic range, corresponding to each intermediate film structure;
• and
• processing the intermediate film structure, determined to have a characteristic within the reference characteristic range, in the next film forming step.