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AssigneeTDK Corporation
InventorAkifumi Kamijima
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The present invention provides a method for forming a photosensitive polyimide pattern 38 on a metal conductor 32, comprising carrying out the following steps (A) to (E) in this order: (A) a step of forming an ester bond type photosensitive polyimide precursor layer 33 by applying an ester bond type photosensitive polyimide precursor composition onto the metal conductor 32; (B) a step of forming an ion bond type photosensitive polyimide precursor layer 34 by applying an ion bond type photosensitive polyimide precursor composition onto the precursor layer 33 until the thickness of the precursor layer 34 reaches a desired thickness; (C) a step of exposing through a mask 35 and transferring the mask pattern as a latent image 36 onto the precursor layers 33 and 34; (D) a step of developing; and (E) a step of forming a polyimide pattern 38 by curing the developed precursor layers 33 and 34.
A method for forming a photosensitive polyimide pattern on a metal conductor, comprising carrying out the following steps (A) to (E) in this order:
An electronic device which comprises an insulating layer formed of a photosensitive polyimide pattern formed on a metal conductor, the photosensitive polyimide pattern obtained by collectively exposing, developing and curing a laminate structure composed of an ester bond type photosensitive polyimide precursor layer and an ion bond type photosensitive polyimide precursor layer formed on the ester bond type photosensitive polyimide precursor layer.
Dependencies are inferred from the claim text.