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US 2006/0068121 A1Published application
Apparatus for treating thin film and method of treating thin film
AssigneeLG. Philips LCD Co., Ltd.
InventorsJong-Chul Lee, Soung-Yeoul Eom, Sang-Hyuck Park
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Abstract
An apparatus for treating a thin film on a substrate includes a stage on which the substrate is disposed. A gas shield faces the substrate. An energy source irradiates a part of the substrate with light emitted therefrom through a retention space of the gas shield. A dispense unit includes a pin nozzle that injects a reaction gas towards the part of the substrate.
Claims43
An apparatus for treating a substrate, comprising:
- a stage adapted to receive the substrate;
- a gas shield facing the substrate and having a retention space;
- an energy source disposed such that light emitted therefrom irradiates a part of the substrate through the retention space;
- and
- a dispense unit including a pin nozzle through which a reaction gas is injected towards the part of the substrate.
2 more elements
A method of treating a thin film on a substrate, comprising:
- placing the substrate on a stage;
- irradiating a part of the substrate with light from an energy source;
- and
- injecting a reaction gas through a pin nozzle to the irradiated part of the substrate such that the reaction gas is activated by the light to treat the thin film.
1 more element
An apparatus for treating a substrate, comprising:
- a stage adapted to receive the substrate;
- a gas shield facing the stage and having a retention space;
- an energy source disposed such that light emitted therefrom radiates towards a part of the stage through the retention space;
- and
- a dispense unit adapted to inject a reaction gas toward the part of the stage, the dispense unit containing a gas supply path and an injection port, the injection port extending from the gas shield towards the stage and having an end with a cross-sectional area substantially smaller than that of the gas supply path.
2 more elements
Dependencies are inferred from the claim text.