Chemical mechanical polishing pad with micro-mold and production method thereof

A method for producing a CMP pad with a micro-mold, the method comprising the steps of:

• making a micro-mold into the shape of a polishing pad such that 1-50% of the area of the polishing pad will be in contact with a wafer and the size of contacting protrusions will be 20-500 μm;
• mixing hydrophilic polymers and urethane with each other at a ratio of 10-20:80-90 so as to prepare a polymer mixture;
• applying the polymer mixture on the surface of the micro-mold to a thickness of 3-8 mm and then degassing the applied polymer mixture using a vacuum casting machine;
• bake-hardening the resulting micro-mold in an oven at a temperature of 50-70° C. for 23-25 hours;
• coating the surface of the micro-mold with a polycarbonate film by a rolling process;
• and
• hardening the polycarbonate film with an UV lamp, thus producing a CMP pad.