Radio frequency module and manufacturing method thereof

Abstract

An enclosure is formed by folding an FPC board having, on the top face thereof, electronic components and, on the back face thereof, a ground conductor pattern in such a way that the electronic components mounted thereon are housed inside the enclosure. The electronic components housed inside the enclosure are covered with the ground conductor pattern. This means that the enclosure serves as a shield enclosure that electromagnetically shields at least part of the electronic components from the outside. In this way, the shield enclosure is formed by folding the FPC board. This makes it possible to realize an electromagnetic shield structure without using an extra shield case as used in the conventional modules.

Dependencies are inferred from the claim text.