Holder for surface mount device during reflow

An apparatus comprising:

• a substrate;
• a plurality of terminals coupled with the substrate;
• a conductive bonding material coupled with the plurality of terminals;
• an electronic device coupled with the conductive bonding material;
• and
• a holder that is coupled with the substrate to hold the electronic device.

A system comprising:

• a DRAM memory;
• and
• a package coupled with the DRAM memory, the package including:
• a substrate;
• a plurality of terminals coupled with the substrate;
• a conductive bonding material coupled with the plurality of terminals;
• an electronic device coupled with the conductive bonding material;
• and
• a holder that is coupled with the substrate to hold the electronic device.

A method comprising:

• coupling a holder with a substrate such that terminals of the substrate are included in an opening of the holder;
• mounting an electronic device over the terminals with a conductive bonding material disposed therebetween;
• heating the conductive bonding material to melt the conductive bonding material;
• and
• cooling the conductive bonding material.