Heat sink module
AssigneeASUSTeK COMPUTER INC.
InventorsCheng-Lai Shen, Chuan-Te Chang
Life of this patent
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Abstract
A heat sink module is used for a central processing unit (CPU). The CPU is located on a top surface of a circuit board. The heat sink module includes a heat conducting structure for conducting and radiating the heat of the CPU. The heat conducting structure goes via the circuit board and extends to a bottom surface of the circuit board.
Claims16
A heat sink module for a central processing unit (CPU) locating on a top surface of a circuit board, comprising:
- a heat conducting structure going via the circuit board and extending to a bottom surface of the circuit board for conducting and radiating heat of the CPU.
A heat sink module for a central processing unit (CPU) locating on a CPU socket module of a top surface of a circuit board, the heat sink module comprising:
- a heat conducting structure connecting to the CPU socket module, going via the circuit board, and extending to a bottom surface of the circuit board for conducting and radiating heat of the CPU.
A heat sink module for a surface of a central processing unit (CPU) locating on a top surface of a circuit board, comprising:
- a heat sink comprising a base and a plurality of fins locating on a surface of the base;
- and
- a heat conducting structure going via the circuit board and extending from the heat sink to a bottom surface of the circuit board for conducting and radiating heat of the CPU.
Dependencies are inferred from the claim text.