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US 2006/0066335 A1Published application
Semiconductor test device with heating circuit
OwnerSeung Kang, Subramanian Karthikeyan +2inventors
InventorsSeung Kang, Subramanian Karthikeyan, Sailesh Merchant, Lisa Mullin
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Abstract
A semiconductor test device includes a test circuit having contacts for applying an electrical signal and measuring electrical parameters of the test circuit. The semiconductor test device also includes an integrally formed heating circuit comprising at least one circuit meander positioned adjacent the test circuit for raising a temperature within a portion of the test circuit.
Claims27
A semiconductor test device comprising:
- a test circuit having contacts for applying an electrical signal and measuring electrical parameters of the test circuit;
- and
- a heating circuit, integrally formed with the semiconductor test device, comprising at least one circuit meander positioned adjacent the test circuit for raising a temperature within a portion of the test circuit.
A semiconductor test device comprising:
- a plurality of test die having contacts for applying an electrical signal and measuring electrical parameters of the test die;
- and
- a plurality of heating circuits, each heating circuit associated with a respective test die, each heating circuit integrally formed within the semiconductor test device and comprising at least one circuit meander positioned adjacent the respective test die for raising a temperature of the respective test die.
A method for evaluating reliability in a test circuit of a semiconductor device comprising:
- integrally forming a heating circuit comprising a circuit meander positioned adjacent a test circuit in the semiconductor device;
- applying an alternating current to the heating circuit to induce heating of the heating circuit;
- and
- measuring an electrical parameter of the test circuit responsive to the heating of the heating circuit.
1 more element
Dependencies are inferred from the claim text.