Electronic apparatus, double-sided display panel and method of manufacturing the double-sided display panel
AssigneeTohoku Pioneer Corporation
InventorsShinsuke Tanaka, Naoki Yazawa
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AssigneeTohoku Pioneer Corporation
InventorsShinsuke Tanaka, Naoki Yazawa
Estimating the term…
It is an object of the present invention to easily connect lead wire section formed on end portion of support substrate to driving circuit parts or a wiring board. A sealing space for sealing up self-emission element sections and is formed between a pair of support substrates. Lead wires for leading signal wires from the sealing space are formed on at least one of the pair of support substrates. Meanwhile, a signal connection member for connecting signal wires formed on the pair of support substrates is formed between the support substrates. In this way, electric signals can be supplied from one support substrate carrying the lead wires formed thereon to the self-emission element section formed on the other support substrate through the signal connection member.
A double-sided display panel formed by bonding together a pair of support substrates each having a self-emission element section formed on one side thereof and a display surface formed on the other by taking out light through each support substrate, in a manner such that the display surfaces are facing in mutually opposite directions, followed by forming a sealing space for sealing up the self-emission element sections between the pair of support substrates,
An electronic apparatus mounting a double-sided display panel according to any one of claims 1 to 10 or 13 to 16.
A method of manufacturing a double-sided display panel formed by bonding together a pair of support substrates each having a self-emission element section formed on one side thereof and a display surface formed on the other by taking out light through each support substrate, in a manner such that the display surfaces are facing in mutually opposite directions, followed by forming a sealing space for sealing up the self-emission element sections between the pair of support substrates,
Dependencies are inferred from the claim text.