Reliable printed wiring board assembly employing packages with solder joints and related assembly technique
AssigneeKyocera Wireless Corp.
InventorsMumtaz Bora, Charles Girardot
Life of this patent
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Abstract
An exemplary assembly comprises a printed wiring board having a first surface, and a package including a plurality of solder joints, such as solder balls, on one surface of the package. An anchor via is defined through the first surface of the printed wiring board, and conductive material situated in the anchor via is connected to or integral with a respective solder joint of the package.
Claims20
An assembly comprising:
- a printed wiring board having a first surface;
- a package including a plurality of solder joints on at least one surface of the package;
- at least one anchor via defined through the first surface of the printed wiring board;
- a conductive material situated in the at least one anchor via, the conductive material connected to at least one of the plurality of solder joints.
An assembly comprising:
- a printed wiring board having a first surface and a plurality of bump attach sites on the first surface;
- a package including a plurality of solder balls on at least one surface of the package;
- at least one anchor via defined through at least one of the plurality of bump attach sites on the first surface of the printed wiring board;
- at least one of the plurality of solder balls filling at least a portion of the at least one anchor via.
A method for assembling a package to a printed wiring board, the printed wiring board having a first surface, the package including a plurality of solder balls on at least one surface of the package, the method comprising:
- forming an anchor via through the first surface of the printed wiring board;
- mounting the package on the printed wiring board such that at least one of the plurality of solder balls contact an opening of the anchor via;
- melting the that at least one of the plurality of solder balls so that a portion of the at least one of the plurality of solder balls fills at least a portion of the anchor via.
Dependencies are inferred from the claim text.