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US 2006/0065971 A1Published application
Electronic circuit packages
AssigneeQinetiq Limited
InventorsJeffrey Powell, Roger Appleby, Mark Moore
Life of this patent
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AssigneeQinetiq Limited
InventorsJeffrey Powell, Roger Appleby, Mark Moore
Estimating the term…
This invention relates to electronic circuit packages designed to hold high frequency circuits operating particularly, but not exclusively, in the microwave, millimetre wave, and sub-millimetre wave bands. The invention provides a package incorporating a cavity in a material for containment of the circuits, wherein the package further incorporates at least one conductive surface mounted on an inner surface extending into the cavity, the conductivity thereof being adapted to be at least partially absorbent to electromagnetic radiation. The conductive surface according to the present invention will tend to attenuate electromagnetic radiation present within the cavity, and so help to prevent undesired coupling from one point to another within the cavity. The conductivity of the conductive material is preferably arranged to match the impedance of the radiation mode estimated or computed to be present within the cavity.
A package for a high frequency electrical circuit comprising a cavity formed within a material for containment of the electrical circuit, characterised in that the package additionally comprises of a material having at least one surface extending into the cavity, the at least one surface having thereupon a conductive material, the conductivity thereof being adapted to be at least partially absorbent to electromagnetic radiation.
A vane for suppressing cavity mode radiation and suitable for mounting within a package for a high frequency electrical circuit, the vane comprising at least in part a layer of conductive material, the conductivity thereof being adapted to be at least partially absorbent to electromagnetic radiation.
A high frequency electrical circuit mounted within a cavity in a package, wherein the cavity has an inner surface on which is positioned a material having a conductive surface extending into the cavity, the conductivity thereof being adapted to be at least partially absorbent to electromagnetic radiation.
A method of manufacturing a package for a high frequency electrical circuit, comprising positioning a conductive surface on an inner surface of the package, the conductive surface extending into the package, and the conductivity thereof being adapted to be at least partially absorbent to electromagnetic radiation.
Dependencies are inferred from the claim text.