Three dimensional package and packaging method for integrated circuits

A 3D package, comprising:

• a three-dimensional (3D) package substrate;
• a land grid array (LGA) or quad flat no-lead (QFN) package mounted on the 3D package substrate, the LGA or QFN package having an LGA or QFN die on a first side of an LGA or QFN package substrate;
• and
• a second die mounted directly on a second side of the LGA or QFN package substrate opposite the first side thereof.

A 3D package, comprising:

• a three-dimensional (3D) package substrate;
• a land grid array (LGA) or quad flat no-lead (QFN) package mounted on the 3D package substrate, the LGA or QFN package having an LGA or QFN die on a first side of an LGA or QFN package substrate, the LGA or QFN package having a plurality of lands wire bonded to contacts on the 3D package substrate, the LGA or QFN package being oriented with the LGA or QFN package substrate facing away from the 3D package substrate;
• a second die mounted on a second side of the LGA or QFN package substrate opposite the first side thereof, the second die having a plurality of contacts wire bonded to contacts on the 3D package substrate;
• a single mass of a molding compound, encapsulating the LGA or QFN package and the second die;
• and
• a plurality of solder balls connected to pads on a side of the 3D package substrate opposite the LGA or QFN package.