Bonding apparatus using conductive material
AssigneeTDK Corporation
InventorsOsamu Shindo, Satoshi Yamaguchi
Life of this patent
Estimating the term…
Abstract
The present invention provides a bonding apparatus in which solder is conveyed onto a predetermined electrode, and the solder is melted by irradiation of a laser beam and is bonded to the electrode and has an object to prevent the solder from adhering to a solder conveying system of the apparatus. To achieve the above object, in the bonding apparatus, a film having low wettability to the solder and having a predetermined thickness such as a DLC film is coated on a region and a neighborhood of a solder holding and conveying member, which is contacted with the solder.
Claims5
A bonding apparatus in which conductive material is supplied to an electrode and a laser beam is irradiated onto said conductive material to melt said conductive material, thereby bonding said conductive material to said electrode, comprising:
- a nozzle adapted to hold said conductive material and capable of resting said conductive material on a conductive material bonding position on said electrode;
- and
- a laser radiating device for irradiating a laser beam onto said conductive material positioned at said bonding position;
- and wherein
- at least a region of said nozzle with which said conductive material contacts is coated by a film having an insulating property and a low wettability to said conductive material and being hard to be adhered by molten conductive material.
Dependencies are inferred from the claim text.