Mounting structure for electronic components

A mounting structure for electronic components, comprising:

• a rigid-flex board comprising a thickness w1;
• an electronic component mounted on the rigid-flex board, the electronic component comprising a lead interval w2 that is smaller than the thickness w1,
• wherein the rigid-flex board comprises a step portion formed at one end portion thereof, and
• the step portion is sandwiched by a lead of the electronic component so as to secure the lead to the step portion.

A mounting structure for electronic components, comprising:

• a circuit board;
• and
• an electronic component mounted on the circuit board;
• wherein the circuit board comprises a step portion formed at a central portion thereof, and a metal layer formed on the step portion, and
• the electronic component is mounted on the metal layer.

A mounting structure for electronic components, comprising:

• a rigid-flex board;
• and
• an electronic component mounted on the rigid-flex board;
• wherein the rigid-flex board comprises a step portion formed at a central portion thereof, and a metal layer formed on the step portion, and
• the electronic component is mounted on the metal layer.

A mounting structure for electronic components, comprising:

• a circuit board;
• and
• an electronic component mounted on the circuit board;
• wherein the circuit board comprises a concave portion formed at an end face thereof, and
• the electronic component comprises a lead inserted and secured within the concave portion.

An optical transceiver, comprising:

• a mounting structure;
• wherein the mounting structure comprises:
• a circuit board;
• and
• an electronic component mounted on the circuit board;
• wherein the circuit board comprises a step portion formed at one end portion thereof, and
• the step portion is sandwiched by a lead of the electronic component so as to secure the lead to the step portion.

An optical transceiver, comprising:

• a mounting structure;
• wherein the mounting structure comprises:
• a rigid-flex board comprising a thickness w1;
• an electronic component mounted on the rigid-flex board, the electronic component comprising a lead interval w2 that is smaller than the thickness w1,
• wherein the rigid-flex board comprises a step portion formed at one end portion thereof, and
• the step portion is sandwiched by a lead of the electronic component so as to secure the lead to the step portion.

An optical transceiver, comprising:

• a mounting structure;
• wherein the mounting structure comprises:
• a circuit board;
• and
• an electronic component mounted on the circuit board;
• wherein the circuit board comprises a step portion formed at a central portion thereof, and a metal layer formed on the step portion, and
• the electronic component is mounted on the metal layer.

An optical transceiver, comprising:

• a mounting structure;
• wherein the mounting structure comprises:
• a rigid-flex board;
• and
• an electronic component mounted on the rigid-flex board;
• wherein the rigid-flex board comprises a step portion formed at a central portion thereof, and a metal layer formed on the step portion, and
• the electronic component is mounted on the metal layer.

An optical transceiver, comprising:

• a mounting structure;
• wherein the mounting structure comprises:
• a circuit board;
• and
• an electronic component mounted on the circuit board;
• wherein the circuit board comprises a concave portion formed at an end face thereof, and
• the electronic component comprises a lead inserted and secured within the concave portion.