Portable etch chamber

A portable XeF2 etching chamber comprising:

• a sealable container comprising an inlet configured for attachment to a vacuum source;
• and
• a holder configured to support at least one MEMS substrate within the sealable container during movement of the sealable container;
• the sealable container being configured to facilitate movement relative to the vacuum source.

A method for etching a MEMS substrate, comprising:

• moving a portable etching chamber to a location in operable proximity to a source of etchant;
• attaching the portable etching chamber to the source of etchant;
• exposing a MEMS substrate supported in the portable chamber to the etchant for a period of time that is effective to etch the MEMS substrate to form a released MEMS substrate;
• detaching the portable etching chamber from the source of etchant;
• moving the portable etching chamber away from the source of etchant;
• and
• unloading the released MEMS substrate from the portable etching chamber.

A method for etching a MEMS substrate, comprising:

• inserting a MEMS substrate into a portable etching chamber;
• moving the portable etching chamber having the MEMS substrate housed therein to a location in operable proximity to an etch station;
• connecting the portable etching chamber to the etch station;
• and
• etching the MEMS substrate within the portable chamber while the portable etching chamber is attached to the etch station.

A portable XeF2 etching chamber comprising:

• a sealable container comprising an inlet configured for attachment to at least one source, the at least one source being selected from the group consisting of a XeF2 vapor source, a vacuum source and a purge gas source;
• and
• a holder configured to support at least one MEMS substrate within the sealable container during movement of the container;
• the sealable container being configured to facilitate movement relative to the at least one source.