Surface activated adhesive systems
AssigneeIllinois Tool Works Inc.
InventorsZakar Hachikian, Sevan Demirdogen
Life of this patent
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Abstract
Methods for adhesive bonding are disclosed. The methods includes contacting a substrate with an activator composition which includes a reactive solvent, such as methyl ethyl ketone or acrylic-based monomers, and a reducing agent, such that the treated substrate has a working time of greater than about four weeks, and contacting the substrate with adhesive compositions to result in adhesive bonding.
Claims20
A method for adhesive bonding using a two-part adhesive having an activator part and an adhesive part comprising:
- (1) contacting a substrate with the activator part to form a treated substrate, the activator part containing a solvent capable of being absorbed by the substrate and at least one pyridine reducing agent, wherein the treated substrate has a working time of less than about 10 weeks.
- (2) contacting the treated substrate with the adhesive part, the adhesive part comprising acrylic-based monomers generally of the structure:
- where R is a functional group containing in the range of from about 1 to about 20 carbon atoms and R1═H or CH3, at least one sulfur-containing compound, and an oxidizing agent selected from the group consisting of peroxides, hydroperoxides, peresters, peracids and the like and mixtures thereof.
A method for pre-activating the surface of a substrate for adhesive bonding comprising:
- (1) contacting the surface of a substrate with a composition comprising a solvent, which contains either methyl ethyl ketone or methyl methacrylate monomer, or both, and at least one pyridine reducing agent to form a treated substrate;
- and
- (2) drying the treated substrate so that the surface of the treated substrate contains no residue.
A method for adhesive bonding using a two-part adhesive having an activator part and an adhesive part comprising:
- (1) contacting a substrate with the activator part to form a treated substrate, the activator part comprising a solvent, which contains either methyl ethyl ketone or methyl methacrylate monomer, or both, and dihydropyridine, to form a treated substrate;
- (2) contacting the treated substrate with the adhesive part, the adhesive part comprising methyl methacrylate, at least one sulfur-containing compound, and cumene hydroperoxide.
Dependencies are inferred from the claim text.