Methods and apparatus for low distortion parameter measurements

A sensor apparatus comprising:

• a base having a substantially rigid surface;
• at least one sensor in physical contact with the base;
• and
• an electronics module comprising components for information-processing and a support structure for suspending at least one of the components away from the surface of the base, the at least one sensor being connected with the components so as to provide signals representing measurements of a process parameter, the support structure having at least one of:
• a thermal resistance so that the measurements are substantially unperturbed by the presence of the electronics module and the electronics module is substantially undamaged by heat transferred from the base to the electronics module and a thermal mass so that the measurements from the sensors are substantially unperturbed by the presence of the electronics module.

A sensor apparatus for measuring temperatures for processing silicon wafers, the sensor apparatus comprising:

• a substantially whole silicon wafer;
• a plurality of temperature sensors in physical contact with the silicon wafer so as to provide temperature measurements;
• and
• at least one electronics module mounted on the silicon wafer, the electronics module comprising an information processor, a power supply, a flexible integrated circuit board comprising polyimide, and a support structure comprising polyimide, the information processor, the power supply, and the sensors being interconnected via the flexible circuit board so that the information processor can receive power from the power supply and signals from the sensors, the support structure being flexibly coupled to the flexible circuit board, the support structure having electrical circuits for transmitting signals from the sensors to the flexible circuit board, the support structure having a flexible portion for physical contact with the silicon wafer, the support structure being configured for suspending the information processor and the power supply away from the surface of the silicon wafer, the support structure being configured so as to provide a rate of conductive heat transfer between the silicon wafer and the electronics module so that the temperature measurements from the sensors are substantially unperturbed by the presence of the electronics module and the electronics module is substantially undamaged by heat transferred from the base to the electronics module, the support structure having a latch mechanism for holding the printed circuit board in a predetermined position.

An electronics module for a sensor apparatus for mounting on a base, the base having at least one sensor mounted thereon, the electronics module being connected with the at least one sensor so as to receive signals from the sensor, the electronics module comprising:

• a bottom section comprising a flexible circuit board having wiring and a plurality of electrical contacts;
• a top section comprising a circuit board and a plurality of components for electronically processing information;
• and
• a middle section comprising a flexible circuit board or a ribbon cable coupled between the bottom section and the top section, wherein, the bottom section physically contacts the base for support and the middle section extends away from the base.

A method of making low distortion measurements of a process parameter in a process chamber for processing workpieces, the method comprising the steps of:

• providing a substrate and a plurality of sensors supported on or in the substrate,
• providing at least one electronic component for information processing;
• supporting the at least one electronic component on a printed circuit board;
• providing a ribbon cable;
• disposing the ribbon cable between the substrate and the printed circuit board so that the printed circuit board is held above the substrate by the ribbon cable so that the printed circuit board does not physically contact the substrate;
• using the ribbon cable to electrically connect the sensors and the at least one electronic component;
• configuring the ribbon cable so as to have heat transfer properties and heat capacity properties sufficient to substantially prevent thermal distortion of measurements made by the plurality of sensors caused by the presence of the ribbon cable;
• establishing the process conditions for the parameter measurements;
• and
• measuring the parameters with the sensors and collecting the measurements with the at least one electronic component.

An electronics module for a sensor apparatus for attachment to a base, the base having at least one sensor mounted thereon, the electronics module being connected with the at least one sensor so as to receive signals from the sensor, the electronics module comprising:

• a bottom section comprising a circuit board having wiring and a plurality of electrical contacts;
• a remote section comprising a circuit board and a plurality of components for electronically processing information;
• and
• a middle section comprising an elongated structure for transmitting information coupled between the bottom section and the remote section, wherein, the bottom section physically connects with the base.

A method of making low distortion measurements of a process parameter in a process chamber for processing workpieces, the process chamber being connected with a robot having a robot arm for loading and unloading the workpieces, the method comprising the steps of:

• A. providing a sensor apparatus having a substrate, a plurality of sensors, at least one electronic component for information processing supported on a printed circuit board, an elongated ribbon cable or an elongated flexible circuit board, and a fastener;
• the plurality of sensors being supported on the substrate, the elongated ribbon cable or the elongated flexible circuit board being electrically connected with the sensors and the at least one electronic component;
• the fastener being coupled to the printed circuit board or to the elongated ribbon cable or the elongated flexible circuit board so that the printed circuit board can be removably attached to the robot;
• B. using the fastener to attach the circuit board to the robot arm;
• C. using the robot to place the substrate in the process chamber;
• D. positioning the robot arm so as to create a predetermined separation between the substrate and the printed circuit board;
• E. establishing the process conditions for the parameter measurements;
• F. measuring the parameters with the sensors and collecting the measurements with the at least one electronic component;
• G. using the robot to remove the substrate from the process chamber;
• and
• H. detaching the circuit board from the robot arm.

An electronics module for a sensor apparatus for attachment to a base, the base having at least one sensor mounted thereon, the electronics module being connected with the at least one sensor so as to receive signals from the sensor, the electronics module comprising:

• a bottom section comprising a circuit board having wiring and a plurality of electrical contacts;
• a remote section comprising a circuit board and a plurality of components for electronically processing information;
• a first electrical connector configured so as to make reversible electrical connections,
• a second electrical connector configured so as to make reversible electrical connections, and
• a middle section comprising a structure for transmitting information, the middle section having a first end and a second end, the first end of the middle section being coupled to the bottom section with the first electrical connector, and the second and other middle section being coupled to the remote section with the second electrical connector, wherein, the bottom section physically connects with the base.