Testing integrated circuits using high bandwidth wireless technology

A wafer comprising:

• a plurality of scribe lines;
• a plurality of antennas, where each of the antennas is formed on one of the scribe lines;
• a plurality of capacitors, each capacitor comprising a first plate connected to one of the antennas, and a second plate not connected to the first plate;
• and
• a plurality of transceivers, where each transceiver is connected to one of the second plates.

A system comprising:

• a tester comprising a transceiver;
• and
• a wafer comprising:
• a plurality of scribe lines;
• a plurality of antennas, where each of the antennas is formed on one of the scribe lines;
• a plurality of capacitors, each capacitor comprising a first plate connected to one of the antennas, and a second plate not connected to the first plate;
• and
• a plurality of transceivers to communicate with the transceiver on the tester, where each transceiver on the wafer is connected to one of the second plates.

A wafer comprising:

• a plurality of scribe lines;
• a plurality of antennas, where each of the antennas is formed on one of the scribe lines;
• a plurality of inductors, each inductor comprising a first winding connected to one of the antennas, and a second winding not connected to the first winding;
• and
• a plurality of transceivers, where each transceiver is connected to one of the second windings.

A system comprising:

• a tester comprising a transceiver;
• and
• a wafer comprising:
• a plurality of scribe lines;
• a plurality of antennas, where each of the antennas is formed on one of the scribe lines;
• a plurality of inductors, each capacitor comprising a first winding connected to one of the antennas, and a second winding not connected to the first plate;
• and
• a plurality of transceivers to communicate with the transceiver on the tester, where each transceiver on the wafer is connected to one of the second windings.

An apparatus comprising:

• a die;
• a set of solder bumps in electrical contact with the die;
• a package in contact with the set of solder bumps;
• a heat spreader adjacent to the die;
• and
• an antenna disposed on the package.

A system comprising:

• a die comprising a UWB transceiver;
• a board comprising an antenna, wherein the antenna is in electrical communication with the die;
• and
• a tester comprising a UWB transceiver to communicate with the UWB transceiver of the die to test the die.