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US 2006/0051953 A1Published application
Module assembly and method for stacked BGA packages
AssigneeMicron Technology, Inc.
InventorsDavid Corisis, Walter Moden, Leonard Mess, Larry Kinsman
Life of this patent
Estimating the term…
Abstract
Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the substantial matching of impedance for the circuits connected to the semiconductor devices.
Claims20
A method of forming a semiconductor assembly comprising:
- providing a plurality of first substrates each of the plurality having a first side, a second side, an aperture therethrough, a plurality of circuits located on the first side and on the second side thereof, and a plurality of connection areas on the first side thereof;
- providing a plurality of semiconductor devices each having an active surface and a plurality of bond pads thereon;
- securing a portion of the active surface of each semiconductor device of the plurality secured to the first side of a first substrate of the plurality;
- extending a wire through the aperture in the first substrate of the plurality and connected to a portion of at least one circuit of the plurality of circuits on the second side of the first substrate and a bond pad of the plurality on the active surface of a semiconductor device of the plurality of semiconductor devices;
- providing a second substrate having a first side, having a second side, and having portions of a plurality of circuits on the first side having a portion of a circuit connected to a portion of a circuit on the second side of a first substrate of the plurality;
- forming a connection between a circuit on the first substrate and a circuit of the second substrate;
- providing a bus bar having a first side, a second side, and a circuit thereon;
- and
- forming a connection between a connection area on the first side of a first substrate and the circuit on the bus bar.
6 more elements
A method for forming a densely stacked semiconductor device assembly having at least a semiconductor device mounted on a first substrate and at least a semiconductor device mounted on a second substrate, the assembly comprising:
- providing a plurality of first substrates, each first substrate of the plurality of first substrates having a first side, a second side, an aperture therethrough, at least one circuit having a portion located on the first side and on the second side thereof, and a plurality of connection areas on the first side thereof;
- providing a plurality of semiconductor devices, each semiconductor device of the plurality having an active surface and a plurality of bond pads thereon;
- securing at least a portion of the active surface of each semiconductor device to the first side of a first substrate of the plurality of first substrates;
- providing a wire extending through the aperture in the first substrate of the plurality of first substrates and connected to the portion of the at least one circuit on the second side of the first substrate and at least one bond pad of the plurality of bond pads on the active surface of a semiconductor device of the plurality of semiconductor devices;
- providing a second substrate having a first side, a second side, and at least two circuits on the first side, one of the at least two circuits connected to the portion of the at least one circuit on the second side of the first substrate of the plurality of first substrates;
- forming at least one connection between the at least one circuit on the first substrate of the plurality of first substrates and the one of the at least two circuits of the second substrate;
- providing a bus bar having a first side, a second side, and at least one circuit thereon;
- forming a connection between one of the plurality of connection areas on the first side of the first substrate of the plurality of first substrates and the at least one circuit on the bus bar;
- and
- forming an electrical component connected to a circuit of the at least two circuits on the first side of the second substrate.
7 more elements
A method for forming an assembly comprising:
- providing a plurality of first substrates each of the plurality having a first side, a second side, an aperture therethrough, a plurality of circuits located on the first side and on the second side thereof, and a plurality of connection areas on the first side thereof;
- providing a plurality of semiconductor devices each having an active surface and a plurality of bond pads thereon;
- securing a portion of the active surface of each semiconductor device of the plurality secured to the first side of a first substrate of the plurality;
- extending a wire through the aperture in the first substrate of the plurality and connected to a portion of at least one circuit of the plurality of circuits on the second side of the first substrate and a bond pad of the plurality on the active surface of a semiconductor device of the plurality of semiconductor devices;
- providing a second substrate having a first side, having a second side, and having portions of a plurality of circuits on the first side having a portion of a circuit connected to a portion of a circuit on the second side of a first substrate of the plurality;
- forming a connection between a circuit on the first substrate and a circuit of the second substrate;
- providing a bus bar having a first side, a second side, and a circuit thereon;
- and
- forming a connection between a connection area on the first side of a first substrate and the circuit on the bus bar.
6 more elements
A method for forming a densely stacked semiconductor device assembly having at least a semiconductor device mounted on a first substrate and at least a semiconductor device mounted on a second substrate, the assembly comprising:
- providing a plurality of first substrates, each first substrate of the plurality of first substrates having a first side, a second side, an aperture therethrough, at least one circuit having a portion located on the first side and on the second side thereof, and a plurality of connection areas on the first side thereof;
- providing a plurality of semiconductor devices, each semiconductor device of the plurality having an active surface and a plurality of bond pads thereon;
- securing at least a portion of the active surface of each semiconductor device to the first side of a first substrate of the plurality of first substrates;
- providing a wire extending through the aperture in the first substrate of the plurality of first substrates and connected to the portion of the at least one circuit on the second side of the first substrate and at least one bond pad of the plurality of bond pads on the active surface of a semiconductor device of the plurality of semiconductor devices;
- providing a second substrate having a first side, a second side, and at least two circuits on the first side, one of the at least two circuits connected to the portion of the at least one circuit on the second side of the first substrate of the plurality of first substrates;
- forming at least one connection between the at least one circuit on the first substrate of the plurality of first substrates and the one of the at least two circuits of the second substrate;
- providing a bus bar having a first side, a second side, and at least one circuit thereon;
- forming a connection between one of the plurality of connection areas on the first side of the first substrate of the plurality of first substrates and the at least one circuit on the bus bar;
- and
- forming an electrical component connected to a circuit of the at least two circuits on the first side of the second substrate.
7 more elements
Dependencies are inferred from the claim text.