Method of separating MEMS devices from a composite structure

A method of separating MEMS devices from a structure having a substrate, a sacrificial layer positioned on a front side of the substrate and a plurality of MEMS devices embedded in the sacrificial layer, the method comprising the steps of:

• securing a front handle wafer to the sacrificial layer;
• etching the substrate from a back side to the sacrificial layer to define one of an individual MEMS integrated circuits and an array of MEMS integrated circuits held together with the sacrificial layer;
• removing the front handle wafer;
• and
• etching away the sacrificial layer to release the MEMS integrated circuits.