Surface acoustic wave device and method for manufacturing the same
AssigneeToyo Communication Equipment Co., Ltd.
InventorYasuhide Onozawa
Life of this patent
Estimating the term…
Abstract
An SAW chip (11) where ones are balanced signal terminals and the others are unbalanced signal terminals is mounted on a mounting board (12) in a flip chip manner, and the mounting board (12) and a surface of the SAW chip are covered with resin (19). At that time, grounds of first and second SAW filters (1, 2) in the SAW chip (11) are connected together and an annular pattern (14) is formed so as to surround a signal pattern of the SAW chip (11) on the mounting board (12) on which the SAW chip (11) is mounted, and the annular electrode (14) is connected to a ground pattern.
Claims7
A SAW device comprising:
- a SAW chip including a plurality of SAW filters with different central frequencies formed on one piezoelectric substrate, ones of input and output terminals of said plurality of SAW filters being constituted as balanced signal terminals and the others thereof being constituted of unbalanced signal terminals;
- amounting board on which said SAW chip is mounted on a connection electrodes via conductive bumps in a flip chip manner;
- and a resin layer which is formed so as to cover the mounting board and a surface of the SAW chip, wherein respective grounds of said plurality of SAW filters are connected together to be connected to one grounding pattern of said mounting board.
A method for manufacturing a SAW device comprising:
- a step of mounting a SAW chip including a plurality of SAW filters with different central frequencies formed on one piezoelectric substrate, ones of input and output terminals of said plurality of SAW filters being constituted as balanced signal terminals and the others thereof being constituted as unbalanced signal terminals, on connection electrodes of a mounting board via conductive bumps in a flip chip manner;
- and a step of, after mounting said SAW chip on said mounting board, forming an annular electrode on said mounting board by forming a metal film.
Dependencies are inferred from the claim text.