Test probe and tester, method for manufacturing the test probe
AssigneeSeiko Epson Corporation
InventorsHaruki Ito, Shinji Mizuno, Koji Yamaguchi
Life of this patent
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Abstract
A test probe having a conductive part electrically connected to terminals of a test-object device, including: a silicon substrate; a protrusion made of resin provided on the silicon substrate; a first conductive part which is provided on the protrusion and comes in contact with the terminals; and a second conductive part which is provided in a region other than a region having the protrusion on the silicon substrate and is electrically connected to the first conductive part.
Claims27
A test probe having a conductive part electrically connected to terminals of a test-object device, comprising:
- a silicon substrate;
- a protrusion made of resin provided on the silicon substrate;
- a first conductive part which is provided on the protrusion and comes in contact with the terminals;
- and
- a second conductive part which is provided in a region other than a region having the protrusion on the silicon substrate and is electrically connected to the first conductive part.
A method for manufacturing a test probe, comprising:
- having a conductive part electrically connected to terminals of a test-object device;
- providing a protrusion made of resin on a silicon substrate;
- providing a first conductive part that comes in contact with the terminals on the protrusion;
- and
- providing a second conductive part that is electrically connected to the first conductive part in a region other than a region having the protrusion on the silicon substrate.
Dependencies are inferred from the claim text.