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US 2006/0049520 A1Published application
Semiconductor device mounting structure for reducing thermal stress and warpage
AssigneeNEC Electronics Corporation
InventorMasanao Horie
Life of this patent
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Abstract
A semiconductor device is composed of a circuit board, a semiconductor chip connected with the circuit board by a plurality of bumps. The semiconductor chip includes a center portion and a peripheral portion surrounding the center portion. The peripheral portion has a thickness smaller than that of the center portion.
Claims7
A semiconductor device comprising:
- a circuit board;
- a semiconductor chip;
- and
- a plurality of bumps connecting said semiconductor chip with said circuit board,
- wherein said semiconductor chip includes a center portion and a peripheral portion surrounding said center portion, a thickness of said peripheral portion being smaller than that of said center portion.
2 more elements
A manufacture method of a semiconductor device, comprising:
- preparing a circuit board and a semiconductor chip;
- providing a plurality of bumps on said semiconductor chip;
- connecting said semiconductor chip with said circuit board by said plurality of bumps;
- and
- selectively grinding a peripheral portion of a rear surface of said semiconductor chip to form a step structure.
2 more elements
Dependencies are inferred from the claim text.