Thin module system and method with skew reduction

A circuit module for reducing thermal variation between constituent CSPs, the module comprising:

• (a) a thermally-conductive rigid substrate having first and second lateral sides, at least two extensions and an edge;
• and
• (b) flex circuitry comprising a first flex circuit populated with a plurality of CSPs and having plural contacts for insertion in an edge connector and a second flex circuit populated with a plurality of CSPs.

The circuit module of claim 13 comprising an instantiation of a FB-DIMM.

A circuit module comprising:

• a thermally-conductive rigid substrate having first and second lateral sides and an edge;
• flexible circuitry populated with plural CSPs and at least one sensor, the flexible circuitry being wrapped about the edge of the thermally-conductive rigid substrate.

A circuit module comprising:

• a flex circuit having a first side and a second side, the first side exhibiting a connective facility disposed between first and second pluralities of first side memory CSPs disposed along the first side, the second side exhibiting first and second pluralities of second side CSPs disposed along the second side;
• an aluminum substrate having first and second lateral sides and at least one extension opposite an edge of the aluminum substrate, the flex circuit being disposed about the edge of the aluminum substrate to dispose the connective facility more proximal to the edge of the substrate than the at least one extension.