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US 2006/0049439 A1Published application
Image device and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsHyeok-Sang Oh, Ju-Hyuck Chung, Kwang-Myeon Park, In-Soo Cho, Seong-Il Kim
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Abstract
An image device includes a substrate in which a light receiving element is formed, an interlayer dielectric structure which is formed on the substrate and has a cavity over the light receiving element, a transparent dielectric layer which fills the cavity and has a lens-shaped portion protruding beyond an upper portion of the interlayer dielectric structure, and a color filter which is formed on the transparent dielectric layer.
Claims23
An image device comprising:
- a substrate including a light receiving element formed therein;
- an interlayer dielectric structure formed on the substrate and having a cavity formed over the light receiving element;
- a transparent dielectric layer, wherein the transparent dielectric layer fills the cavity and including a lens-shaped portion protruding beyond an upper portion of the interlayer dielectric structure;
- and
- a color filter which is formed on the transparent dielectric layer.
2 more elements
An image device comprising:
- a substrate including a light receiving element formed therein;
- a semiconductor device for driving the light receiving element;
- an interlayer dielectric structure formed on the substrate, the interlayer dielectric structure including etch stop layers and interlayer dielectric layers, wherein copper contacts electrically connected to the semiconductor device and copper interconnects are formed, and the interlayer dielectric structure having a cavity formed by removing respective portions of the etch stop layers and interlayer dielectric layers formed over the light receiving element;
- a transparent dielectric layer, wherein the transparent dielectric layer fills the cavity and includes a convex lens-shaped portion protruding beyond an upper portion of the interlayer dielectric structure;
- and
- a color filter formed on the transparent dielectric layer.
3 more elements
An image device comprising:
- a substrate including a light receiving element formed therein;
- a semiconductor device for driving the light receiving element;
- an interlayer dielectric structure formed on the substrate, the interlayer dielectric structure including etch stop layers and interlayer dielectric layers, wherein copper contacts electrically connected to the semiconductor device and a copper interconnects are formed, and the interlayer dielectric structure having a cavity formed by removing the etch stop layers and interlayer dielectric layers formed over the light receiving element;
- a transparent dielectric layer, wherein the transparent dielectric layer fills the cavity and includes a concave lens-shaped portion protruding beyond an upper portion of the interlayer dielectric structure;
- a color filter formed on the transparent dielectric layer;
- and
- a convex micro lens formed on the color filter.
4 more elements
A method of fabricating an image device comprising:
- forming a semiconductor device for driving a light receiving element, and forming an interlayer dielectric structure including copper contacts electrically connected to the semiconductor device and copper interconnects, on a substrate including the light receiving element formed therein;
- removing a portion of the interlayer dielectric structure disposed on over upper portion of the light receiving element to form a cavity;
- forming a transparent dielectric layer having a thickness to fill the cavity;
- forming an upper portion of the transparent dielectric layer over the light receiving element to form a first micro lens;
- and
- forming a color filter on the first micro lens.
3 more elements
A method of fabricating an image device comprising:
- forming a semiconductor device for driving a light receiving element, and forming an interlayer dielectric structure including copper contacts electrically connected to the semiconductor device and copper interconnects, on a substrate including the light receiving element formed therein;
- removing a portion of the interlayer dielectric structure disposed over the light receiving element to form a cavity;
- forming a transparent dielectric layer having a thickness to fill the cavity, the transparent dielectric layer being formed to a predetermined thickness such that an upper portion of the cavity has a concave profile;
- removing the transparent dielectric layer except for the transparent dielectric layer disposed over the light receiving element to form a first micro lens wherein the upper portion of the transparent dielectric layer is formed into a concave lens shape;
- forming a color filter on the first micro lens;
- and
- forming a second micro lens on the color filter.
4 more elements
Dependencies are inferred from the claim text.