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US 2006/0049422 A1Published application
Surface mount LED
OwnerIwao Shojiinventor
Life of this patent
Estimating the term…
Abstract
An LED can include a silicon substrate that has a conductive pattern including an LED chip equipped portion, a connection portion, and external electrodes. A glass frame can be anodic-bonded onto the silicon substrate, and can include a through-hole forming a lamp house. An LED chip can be mounted onto the silicon substrate in the through-hole of the glass frame, and a mold portion made of silicone resin can be filled into the through-hole of the glass frame.
Claims28
An LED comprising:
- a silicon substrate, including a conductive pattern having an LED chip equipped portion, a connection portion, and electrodes;
- a glass frame anodic-bonded onto the silicon substrate, and including an opening forming a lamp house;
- an LED chip mounted adjacent the silicon substrate in the opening of the glass frame;
- and
- a mold portion of silicone resin located in the opening of the glass frame.
2 more elements
Dependencies are inferred from the claim text.