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US 2006/0049155 A1Published application
Wafer level package fabrication method using laser illumination
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKook Sunwoo, Jong Kwon, Joo Lee
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Abstract
The present invention relates to a WLP fabrication method capable of welding a lid wafer with a device wafer by using laser illumination. The WLP fabrication method can rapidly weld bonding metal strips of device and lid wafers with each other in order to couple the lid wafer with the device wafer while sealing an internal cavity from the outside without giving any thermal effect to a drive unit in the device wafer.
Claims9
A method for fabricating wafer level packages, the method comprising the following steps of:
- (a) preparing a device wafer having a micro-drive unit arranged in at least one package area and an enclosed metal strip arranged along a periphery of the package area spaced from the drive unit;
- (b) preparing a lid wafer having an enclosed metal strip formed thereon matching the metal strip on the device wafer;
- (c) mounting the device wafer on a support member with the metal strip facing upward, and mounting the lid wafer on the device wafer with the metal strip of the lid wafer butting on the metal strip of the device wafer;
- (d) illuminating a laser beam from a laser source onto the entire package area to weld the metal strips together without thermal effect to the drive unit so as to seal an internal space defined by the metal strips between the wafers;
- and
- (e) cutting a resultant structure along an outer periphery of a resultant welded metal strip.
3 more elements
Dependencies are inferred from the claim text.